Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around ...

Hungry individuals don't put much thought into the packaging of their food. When people grab a snack, they generally rip into ...

RIT’s packaging science program recently received an equipment donation for its Packaging Dynamics Laboratory that will increase its academic and professional training options in safe-guarding shipped ...

Following a successful Virtual Engineering Week event, which took place November 30 – December 4, 2020, Virtual Engineering Days is the second digital event offered ahead of the upcoming Informa ...