Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc., the world’s leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is ...
June 24, 2024 -- Plano, Texas, USA -- Siemens Digital Industries Software today introduced Solido™ Simulation Suite software(“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast ...
Agilent claims a breakthrough for achieving accurate response in time-domain simulators when it comes to pcb interconnects at data rates of more than 1 Gb/s — enter the Signal Integrity Designer ...
Mobile devices, like cell phones and portable game consoles, require memory systems that meet two key requirements: low power dissipation and high packaging density. In order to meet these ...
â CGTech presents Version 8 of its VERICUT software for simulation, verification, and optimization of various CNC-machine operations from composite-part drilling to water-jet cutting. The software ...
Yan Liu receives funding from Australia Research Council and University of Queensland. Iderlina Mateo-Babiano receives funding from the Australian Research Council, Department of Foreign Affairs and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback